Hefner Jr., A.
and Blackburn, D.
(1994),
Thermal Component Models for Electrothermal Network Simulation, IEEE Transactions on Components and Packaging Technologies, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=28551
(Accessed September 16, 2024)
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Thermal Component Models for Electrothermal Network Simulation
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,
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IEEE Transactions on Components and Packaging Technologies
Volume
A 17
Issue
3
Pub Type
Journals
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Created December 30, 1994, Updated October 12, 2021