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Test Procedures for Developing Solder Data

Published

Author(s)

Thomas A. Siewert, C A. Handwerker

Abstract

This publication documents standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders. Such data speeds the application of lead-free solders in high-volume, automated production of electronic assemblies, especially when current production expectations combine high levels of quality with the lowest cost. Use of standardized procedures facilitates the comparison of data between laboratories, and permits the combination of data from different sources into a single, comprehensive database.
Citation
Special Publication (NIST SP) - 960-8
Report Number
960-8
Volume
SP960-8

Keywords

electronics assembly, lead-free alloys, mechanical testing, property data, solder, standardized procedures, test procedures

Citation

Siewert, T. and Handwerker, C. (2002), Test Procedures for Developing Solder Data, Special Publication (NIST SP), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NBS.SP.960-8 (Accessed December 5, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created August 1, 2002, Updated November 10, 2018