NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
This publication documents standardized test procedures that can produce valid and reproducible mechanical property data for lead-free solders. Such data speeds the application of lead-free solders in high-volume, automated production of electronic assemblies, especially when current production expectations combine high levels of quality with the lowest cost. Use of standardized procedures facilitates the comparison of data between laboratories, and permits the combination of data from different sources into a single, comprehensive database.
Siewert, T.
and Handwerker, C.
(2002),
Test Procedures for Developing Solder Data, Special Publication (NIST SP), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NBS.SP.960-8
(Accessed October 16, 2025)