Jones, M.
, Roberts, J.
, Hood, C.
, Cresswell, M.
and Allen, R.
(1991),
Test Chip for the Evaluation of Surface Diffusion Phenomena in Sputtered Aluminum Planarization Processes, Proc., IEEE International Conference on Microelectronic Test Structures, Kyoto, 1, JA
(Accessed May 2, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Test Chip for the Evaluation of Surface Diffusion Phenomena in Sputtered Aluminum Planarization Processes
Published
Author(s)
M. A. Jones, , , ,
Proceedings Title
Proc., IEEE International Conference on Microelectronic Test Structures
Volume
4
Conference Dates
March 18-20, 1991
Conference Location
Kyoto, 1, JA
Pub Type
Conferences
Citation
Created December 30, 1991, Updated October 12, 2021