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Test Chip for the Evaluation of Surface Diffusion Phenomena in Sputtered Aluminum Planarization Processes

Published

Author(s)

M. A. Jones, John W. Roberts, Colleen E. Hood, Michael W. Cresswell, Richard A. Allen
Proceedings Title
Proc., IEEE International Conference on Microelectronic Test Structures
Volume
4
Conference Dates
March 18-20, 1991
Conference Location
Kyoto, 1, JA

Citation

Jones, M. , Roberts, J. , Hood, C. , Cresswell, M. and Allen, R. (1991), Test Chip for the Evaluation of Surface Diffusion Phenomena in Sputtered Aluminum Planarization Processes, Proc., IEEE International Conference on Microelectronic Test Structures, Kyoto, 1, JA (Accessed July 14, 2024)

Issues

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Created December 30, 1991, Updated October 12, 2021