A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film

Published

April 1, 2002

Author(s)

Martin Y. Chiang, C. K. Chiang, Wen-Li Wu

Abstract

A technique for determining the in-plane modulus and the coefficient of thermal expansion (CTE) of supported thin films has been developed. The modulus and CTE are calculated by solving two coupled equations that relate the curvature of film samples deposited on two different substrates to the thermal and mechanical properties of the constituents. In contrast with the conventional method used to calculate modulus and CTE, which involves differentiation of the thermal stress in the film, this new technique does not require the differentiating step on the thermal stress, and can also provide the temperature-dependent in-plane CTE and elastic modulus of supported thin films. The data reduction scheme used for deducing CTE and elastic modulus is direct and reliable.

Citation

Journal of Engineering Materials and Technology - Transactions of the ASME

Volume

124

Issue

No. 2

Pub Type

Journals

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Keywords

CTE, in-plane modulus, thermal strain, thermal stress, thin film

Citation

Chiang, M. , Chiang, C. and Wu, W. (2002), A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film, Journal of Engineering Materials and Technology - Transactions of the ASME, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851770 (Accessed October 21, 2025)