Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film

Published

Author(s)

Martin Y. Chiang, C. K. Chiang, Wen-Li Wu

Abstract

A technique for determining the in-plane modulus and the coefficient of thermal expansion (CTE) of supported thin films has been developed. The modulus and CTE are calculated by solving two coupled equations that relate the curvature of film samples deposited on two different substrates to the thermal and mechanical properties of the constituents. In contrast with the conventional method used to calculate modulus and CTE, which involves differentiation of the thermal stress in the film, this new technique does not require the differentiating step on the thermal stress, and can also provide the temperature-dependent in-plane CTE and elastic modulus of supported thin films. The data reduction scheme used for deducing CTE and elastic modulus is direct and reliable.
Citation
Journal of Engineering Materials and Technology - Transactions of the ASME
Volume
124
Issue
No. 2

Keywords

CTE, in-plane modulus, thermal strain, thermal stress, thin film

Citation

Chiang, M. , Chiang, C. and Wu, W. (2002), A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film, Journal of Engineering Materials and Technology - Transactions of the ASME, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851770 (Accessed April 20, 2024)
Created April 1, 2002, Updated June 2, 2021