Cook, R.
, Gerbig, Y.
, Vaudin, M.
, Schoenmaker, J.
and Stranick, S.
(2009),
Stress-Intensity Factor and Toughness Measurement at the Nanoscale using Confocal Raman Microscopy, 12th International Conference on Fracture, Ottawa, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=900910
(Accessed April 26, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Stress-Intensity Factor and Toughness Measurement at the Nanoscale using Confocal Raman Microscopy
Published
Author(s)
, , , Jeroen Schoenmaker,
Abstract
A confocal Raman microscopy technique is presented that allows stress measurement at the nanoscale, which in turn enables measurement of stress-intensity factors (SIF) at crack tips and thus toughness to be estimated. Peak-fitting and super-resolution techniques enable stress resolution of approximately 20 MPa at spatial resolution of approximately 100 nm. Micro- and nano-indentation and crack field stress distributions are measured and compared with analytical expressions. The SIF for indentation cracks in Si is shown to be in the range 0.2 MPa m1/2 to 0.4 MPa m1/2, consistent with chipping-induced indentation stress relief and the toughness of Si.Proceedings Title
12th International Conference on Fracture
Conference Dates
July 12-17, 2009
Conference Location
Ottawa, CA
Pub Type
Conferences
Download Paper
Citation
Created July 12, 2009, Updated February 19, 2017