Stress Analysis for Combinatorial Buckling-Based Metrology of Thin Film Modulus

Published

January 1, 2005

Author(s)

Shu Guo, Christopher M. Stafford, Martin Y. Chiang

Abstract

We recently reported on a new buckling-based metrology for probing the elastic modulus of thin polymer films. In this experimental geometry, a thin film of interest is transferred to a relatively thick elastic substrate, and buckling is induced by compression of the laminate. This buckling instability is highly periodic with a wavelength that is dependent on the mechanical properties of both the upper film and substrate as well as the thickness of the upper film. We argue that this new metrology is ideally positioned as a unique combinatorial and/or high-throughput measurement platform since gradient films can be easily integrated into the experimental design and the measurement time is a matter of seconds per data point. Gradient films could be continuous or discrete as a function of spatial position in the film. A crucial concern in this new metrology is the potential for interactions between neighboring sections along the gradient. The primary example of this would be a sample with discrete changes in modulus of the material being studied. The stresses acting on the adjacent specimens may interact with each other if they are too close, thus the wavelength on the buckled the specimen would deviate from a single specimen with same geometric and material properties. In this presentation, a numerical analysis with FEA is conducted to investigate such interactions.

Proceedings Title

Adhesion Society | 28th | Annual Meeting Proceedings

Volume

16

Conference Dates

February 13-16, 2005

Conference Title

Adhesion Society

Pub Type

Conferences

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Keywords

buckling, combinatorial method, high throughput, mechanical properties, thickness gradient, thin film

Citation

Guo, S. , Stafford, C. and Chiang, M. (2005), Stress Analysis for Combinatorial Buckling-Based Metrology of Thin Film Modulus, Adhesion Society | 28th | Annual Meeting Proceedings, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852471 (Accessed October 3, 2024)