Spatially and Temporally Resolved Thermal Imaging of Cyclically Heated Interconnects by Use of Scanning Thermal Microscopy

Published

January 1, 2008

Author(s)

Nicholas Barbosa, Andrew J. Slifka

Abstract

A scanning thermal microscope (SThM) was used to investigate the spatial and temporal distribution of temperature in electrical interconnect structures designed for measuring the mechanical properties of thin films. Knowledge of the thermal behavior of the interconnect structures is required to understand the imposed strain state during mechanical property measurements. A Wollaston wire probe was utilized in passive temperature sensing mode for SThM measurements. The probe was calibrated through a novel method utilizing a microfabricated single layer heater and sensor structure. Results show a diffuse temperature distribution with an average temperature and peak-to-valley temperature that both increased from a minimum value at the end of the line-length to a maximum at the center of the line-length. Time-resolved temperature measurements were performed and used to determine the maximum temperature swings at several locations in the linewidth. Temperature was shown to vary in both the width and length of the lines.

Citation

Microscopy Research and Technique

Volume

71

Pub Type

Journals

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Keywords

scanning thermal microscope, SThM, thin film, interconnect, temperature distribution, calibration

Citation

Barbosa, N. and Slifka, A. (2008), Spatially and Temporally Resolved Thermal Imaging of Cyclically Heated Interconnects by Use of Scanning Thermal Microscopy, Microscopy Research and Technique, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50398 (Accessed October 27, 2025)