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Single cantilever peel test for analysis of adhesion strength in nanotransfer printing

Published

Author(s)

Deuk Y. Lee, Gottlieb Oehrlein, Daniel R. Hines, Jiong Liu, Jun Y. Chung, Christopher Stafford, Christopher Soles, Eric K. Lin

Abstract

Nanotransfer printing (NTP) has attracted much attention as a method for fabricating nanoscale structures using materials that are not generally compatible with conventional lithographic techniques. For NTP of a polymer film to a polymer substrate, thermal cycling above the glass transition temperature has been shown to assist pattern transfer. However, this can cause distortion of printed layers and volume shrinkage of polymer films and substrates. Therefore, for NTP involving thermoplastic polymer materials, a low processing temperature (below the glass transition temperature (Tg) of the polymers) is desirable. One key factor influencing pattern transfer is the strength of adhesion between the printed layer and the thermoplastic substrate. In this paper, we evaluate plasma surface activation of polymer films and substrates as an approach enabling low temperature NTP processing.
Proceedings Title
31st Annual meeting of the Adhesion Society
Conference Dates
February 17-20, 2008
Conference Location
Austin, TX, US

Keywords

adhesion, electronics, flexible, fracture, interface, nanotransfer, plasma, polymer, surface

Citation

Lee, D. , Oehrlein, G. , Hines, D. , Liu, J. , Chung, J. , Stafford, C. , Soles, C. and Lin, E. (2008), Single cantilever peel test for analysis of adhesion strength in nanotransfer printing, 31st Annual meeting of the Adhesion Society, Austin, TX, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854489 (Accessed February 23, 2024)
Created February 16, 2008, Updated October 12, 2021