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Single cantilever peel test for analysis of adhesion strength in nanotransfer printing
Published
Author(s)
Deuk Y. Lee, Gottlieb Oehrlein, Daniel R. Hines, Jiong Liu, Jun Y. Chung, Christopher Stafford, Christopher Soles, Eric K. Lin
Abstract
Nanotransfer printing (NTP) has attracted much attention as a method for fabricating nanoscale structures using materials that are not generally compatible with conventional lithographic techniques. For NTP of a polymer film to a polymer substrate, thermal cycling above the glass transition temperature has been shown to assist pattern transfer. However, this can cause distortion of printed layers and volume shrinkage of polymer films and substrates. Therefore, for NTP involving thermoplastic polymer materials, a low processing temperature (below the glass transition temperature (Tg) of the polymers) is desirable. One key factor influencing pattern transfer is the strength of adhesion between the printed layer and the thermoplastic substrate. In this paper, we evaluate plasma surface activation of polymer films and substrates as an approach enabling low temperature NTP processing.
Lee, D.
, Oehrlein, G.
, Hines, D.
, Liu, J.
, Chung, J.
, Stafford, C.
, Soles, C.
and Lin, E.
(2008),
Single cantilever peel test for analysis of adhesion strength in nanotransfer printing, 31st Annual meeting of the Adhesion Society, Austin, TX, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854489
(Accessed October 1, 2025)