Harman, G.
(1989),
The Silicon and GaAs Wire-Bond Cratering Problem, Book of Abstracts of the 1988 IEEE VLSI and GaAs Packaging Workshop, Santa Clara, CA
(Accessed March 13, 2025)
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The Silicon and GaAs Wire-Bond Cratering Problem
Published
Author(s)
Proceedings Title
Book of Abstracts of the 1988 IEEE VLSI and GaAs Packaging Workshop
Conference Dates
September 12-14, 1988
Conference Location
Santa Clara, CA
Pub Type
Conferences
Citation
Issues
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Created December 31, 1989, Updated February 17, 2017