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The Silicon and GaAs Wire-Bond Cratering Problem

Published

Author(s)

George G. Harman
Proceedings Title
Book of Abstracts of the 1988 IEEE VLSI and GaAs Packaging Workshop
Conference Dates
September 12-14, 1988
Conference Location
Santa Clara, CA

Citation

Harman, G. (1989), The Silicon and GaAs Wire-Bond Cratering Problem, Book of Abstracts of the 1988 IEEE VLSI and GaAs Packaging Workshop, Santa Clara, CA (Accessed February 25, 2024)
Created December 31, 1989, Updated February 17, 2017