Selection of Calibration Particles for Scanning Surface Inspection Systems

Published

August 8, 1996

Author(s)

George W. Mulholland, Nelson P. Bryner, Walter S. Liggett Jr, B W. Scheer, R. K. Goodall

Abstract

In response to the semiconductor industry's need for both smaller calibration particles and more accurately sized larger particles, a joint SEMATECH, National Institute of Standards and Technology, and VLSI Standards, Inc. project was initiated to accurately characterize 10 monodisperse polystyrene sphere suspensions covering the particle diameter range from 70 to 900 nm. The sizing analyis is being performed by electrical mobility analysis with a modified flow system to enable the measurement of the width of narrow size distributions. Results are presented on the mean size and the width of the distribution for candidate samples provided by five suppliers. The target sizes for the first set of particles are 72 nm, 87 nm, 125 nm, and 180 nm. Challenges for detecting "real world" particles are discussed including quantitative examples of the effects of refractive index, layered structure, and non-spherical shape on the light scattered by a particle.

Proceedings Title

International Society for Optical Engineering (SPIE)

Volume

2862

Conference Dates

August 8-9, 1996

Conference Location

Denver, CO

Conference Title

Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays

Pub Type

Conferences

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Local Download

Keywords

differential mobility analyzer, electrical mobility, light scattering intenstiy, microcontamination, nomodisperse spheres, polystyrene latex spheres, real world particles, wafer scanner, width of size distribution, suspensions

Citation

Mulholland, G. , Bryner, N. , Liggett, W. , Scheer, B. and Goodall, R. (1996), Selection of Calibration Particles for Scanning Surface Inspection Systems, International Society for Optical Engineering (SPIE), Denver, CO, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=910979 (Accessed October 14, 2024)