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PUBLICATIONS

Security Advantages and Challenges of 3D Heterogenous Integration

Published

Author(s)

Yuntao Liu, Daniel Xing, Isaac McDaniel, Olsan Ozbay, Abir Ahsan Akib, Mumtahina Islam Sukanya, Sanjay (Jay) Rekhi, Ankur Srivastava

Abstract

Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.
Citation
IEEE Computer Magazine
Volume
57
Issue
3
Pub Type
Journals

Download Paper

https://doi.org/10.1109/MC.2023.3340798
Local Download

Keywords

3D Heterogeneous Integration, Hardware Security, Split Manufacturing, Side-Channel Attacks
Cybersecurity

Citation

Liu, Y. , Xing, D. , McDaniel, I. , Ozbay, O. , Akib, A. , Sukanya, M. , Rekhi, S. and Srivastava, A. (2024), Security Advantages and Challenges of 3D Heterogenous Integration, IEEE Computer Magazine, [online], https://doi.org/10.1109/MC.2023.3340798, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=957100 (Accessed December 15, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created March 6, 2024, Updated August 21, 2024