Publications

Displaying 1 - 4 of 4

SpherIndent: An open-source python software for calibration, analysis and visualization of spherical nanoindentation experiments

August 1, 2026

Author(s)

Nicolas Alderete, Yvonne Gerbig

Instrumented indentation (nanoindentation) remains a leading technique for micro- and nanoscale mechanical characterization. Unlike other indenter geometries, spherical probes enable separation of elastic and plastic regimes and extraction of stress–strain

Multiscale Mechanical Characterization of Hybrid-Bonding Copper: From Instrumented Indentation to AFM

June 17, 2026

Author(s)

Gheorghe Stan, Yvonne Gerbig, Nicolas Alderete, Paresh Daharwal, Cristian Victor Ciobanu

As transistor dimensions approach their physical scaling limits, advanced packaging has emerged as an effective solution to today's challenging demands. Hybrid bonding (HB), in particular, has become a disruptive enabler in this space. With interconnect

ATOMIC FORCE MICROSCOPY-BASED MODES FOR NANOSCALE ELASTIC-PLASTIC CHARACTERIZATION OF MATERIALS USED IN HYBRID BONDING

February 17, 2026

Author(s)

Gheorghe Stan, Nicolas Alderete, Cristian Victor Ciobanu, Paresh Daharwal

One of the most promising techniques for integration in advanced packaging is hybrid bonding, which connects dies and wafers without the need for solder bumps. This method enables a higher density of interconnects with a pitch scale of less than 10

Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy

December 19, 2025

Author(s)

Gheorghe Stan, Nicolas Alderete, Cristian Victor Ciobanu, Paresh Daharwal

The slowdown of Moore's law has elicited a paradigm shift whereby 2D shrinking is being replaced by 3D-stacking advanced packaging approaches to satisfy the ever-increasing demands for power, performance, area, and cost. Driven by the widespread use of

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