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Displaying 26 - 50 of 62

Information management for Environmental Concerns

February 8, 2008
Author(s)
Eric D. Simmon, John V. Messina, Kevin G. Brady
Around the world there is a growing awareness that the environmental impact from manufacturing needs to be minimized. Concerns about issues from toxic materials ending up in landfills to manufacturing process chelmicals causing health problems are causing

The NIST Calibration Check Standards Database

June 1, 2007
Author(s)
Kevin G. Brady, Frederic J. de Vaulx, Randolph Elmquist
For several years now, NIST has been a leader in the development and use of Information Technology to process calibration information. Beginning in 1996, researchers designed and developed a calibration database, the NIST Information System to Support

Automating Thermo-Mechanical Warpage Estimation of PCBs/PCAs using a Design-Analysis Integration Framework

August 18, 2006
Author(s)
Manas Bajaj, Russell Peak, Dirk Zwemer, Thomas Thurman, Lothar Klein, Giedrius Liutkus, Kevin G. Brady, John V. Messina, Mike Dickerson
Accurate prediction, validation and reduction of thermally-induced PCB warpage are critical for enhancing manufacturing yield and reliability in time-to-market driven electronics product realization. In this paper, we describe a methodology to simulate

Next Generation Simulation-based Design Technologies for Electronics Product Realization

May 1, 2005
Author(s)
Manas Bajaj, Dirk Zwemer, Russell Peak, Mike Dickerson, Thomas Thurman, Kevin G. Brady, John V. Messina
The realm of electronics product realization is marked by an extremely fast-paced market, stringent demands for product reliability and high importance to innovative design. Further, the time-to-market and the cost-to-realize play a critical role for

PWB Warpage Analysis and Verification using an AP210 Standards-based Engineering Framework and Shadow Moire

March 10, 2004
Author(s)
Dirk Zwemer, Manas Bajaj, Russell Peak, Thomas Thurman, Kevin G. Brady, S McCarron, A Spradling, Mike Dickerson, Lothar Klein, Giedrius Liutkus, John V. Messina
Thermally induced warpage of printed wiring boards (PWB) and printed circuit assemblies (PCA) is an increasingly important issue in managing the manufacturing yield and reliability of electronic devices. In this paper, we introduce complementary simulation

Information Technology for Engineering and Manufacturing

May 10, 2000
Author(s)
Michael Gruninger, Barbara L. Goldstein, Kevin G. Brady, Simon Szykman, Charles R. McLean, Joshua Lubell
Advances in information technology are frequently cited as the basis for the continued growth of the U.S. economy. Manufacturers use information technology products to increase productivity, to decrease time-to-market, to lower supply chain costs, and to

An Information System to Support Calibration

November 1, 1999
Author(s)
Kevin G. Brady
The National Institute of Standards and Technology (NIST) performs calibrations that achieve the highest level of measurement quality for the makers and users of precision devices world-wide. The information system that administers these calibrations

Conformance Testing Object-Oriented Frameworks Using JAVA

October 1, 1998
Author(s)
Kevin G. Brady, James A. St Pierre
This paper details the assumptions, decision processes, and conclusions reached during the development and implementation of a Conformance Testing Tool using the JAVA [JAVA] programming language, and the Object Management Group's (OMG's) Common Object

Conformance Testing Object-Oriented Frameworks Using JAVA

July 1, 1998
Author(s)
Kevin G. Brady, James A. St Pierre
This paper details the assumptions, decision processes, and conclusions reached during the development and implementation of a Conformance Testing Tool using the JAVA [JAVA] programming language, and the Object Management Group's (OMG's) Common Object