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Displaying 51 - 75 of 160

Numerical Modeling of Diffusion-Induced Deformation

September 11, 2006
Author(s)
J A. Dantzig, William J. Boettinger, James A. Warren, Geoffrey B. McFadden, Sam R. Coriell, R F. Sekerka
We present a numerical approach to modeling the deformation induced the the Kirkendall effect in binary alloys. The governing equations for isothermal binary diffusion are formulated with respect to inert markers and also with respect to the volume

Whisker Formation in Pb-Free Surface Finishes

September 11, 2006
Author(s)
Gery R. Stafford, Maureen E. Williams, C E. Johnson, Kil-Won Moon, Ugo Bertocci, William J. Boettinger
High purity bright Sn, Sn-Cu and Sn-Pb layers measuring 3,7 and 16 microns thick were electrodeposited onto phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min. of plating proved that all

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

November 11, 2005
Author(s)
William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of several days, Sn-Cu deposits develop 50 mm contorted hillocks and 200 mm whiskers, pure Sn

Examination of Multicomponent Diffusion Between Two Ni-Base Superalloys

September 11, 2005
Author(s)
Carelyn E. Campbell, William J. Boettinger, T Hansen, P Merewether, B A. Mueller
The interdiffusion at 1293 degree C between two multicomponent Ni-base superalloys, Rene-N4 and ene-N5, was assessed by measuring the composition vs. distance curves and by comparing the measured curves to predictions obtained using a diffusion mobility

Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

September 11, 2005
Author(s)
Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger
To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the

Lateral Deformation of Diffusion Couples

April 1, 2005
Author(s)
William J. Boettinger, Geoffrey B. McFadden, Sam R. Coriell, R F. Sekerka, James A. Warren
A model is proposed to describe the shape change (displacement field) of a binary diffusion couple when the intrinsic (lattice) diffusivities of the two substitutional atomic species differ. As for the Kirkendall effect, the displacement is due the