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Search Publications

NIST Authors in Bold

Displaying 1 - 25 of 74400

Certification of Standard Reference Material(R) 3223: Inorganic Constituents in Cigarette Tobacco Filler

July 22, 2026
Author(s)
Lee Yu, Colleen Bryan Sallee, Korina Menking-Hoggatt, Debra Ellisor, James Fort, Jennifer Hoguet, Jenna Klingsick, Amanda Moors, Jennifer Ness, James Yen, Naudia Gray, Richard Pappas
The National Institute of Standards and Technology (NIST) Standard Reference Material® (SRM®) 3223 Inorganic Constituents in Cigarette Tobacco Filler is intended for use in the validation of procedures and methods for the determination of inorganic

Supporting molecular detection of A(H5N1) through development and characterization of RNA reference materials

July 22, 2026
Author(s)
Eileen Moran, Monique Hunter, Jason Kralj, Kristine Gierz, Julia Frederick, Jimma Liddell, Lisa Keong, Bo Shu, John Barnes, Jasmine Chaitram, Marie Kirby, Todd Davis, Stephanie Servetas, Scott Jackson, Peter Vallone, Megan Cleveland
In 2024, the US Centers for Disease Control and Prevention (CDC) and National Institute of Standards and Technology (NIST) initiated an interagency collaboration to bolster preparedness in the event of a pandemic scenario due to high pathogenicity avian

Development of a Multi-Criteria Indicator for Product Life Cycle Decision-Making

July 21, 2026
Author(s)
Yong Han Kim, Sidi Deng, Thomas Maani, Matthew Triebe, Nehika Mathur, John Sutherland
Maximizing product value and resource efficiency has been widely regarded as a key objective throughout the product life cycle, supported by improved product designs, informed manufacturing decisions, and regenerative approaches. Although the evaluation of

Digital Twins Workshops Summary Report

July 21, 2026
Author(s)
Simon Frechette, Guodong Shao, Michael Pease
This report summarizes the outcomes of a three-part NIST workshop series on digital twins for manufacturing. The workshops convened experts from industry, academia, and government to establish a shared understanding of digital twin fundamentals, identify

A model of the heat sealing process for multilayer films with molecular detail

July 20, 2026
Author(s)
Marat Andreev, Chinmay Gangal, Anthony Kotula, Jeffrey Weinhold, Jonathan Moore, Gregory Rutledge
Heat sealing of multilayer polymer films is a critical step in the packaging of food, consumer products, and various other commercial items. Each layer comprises a resin that is specifically designed to impart a particular property to the final package

RADmapper: An Interoperable Mapping Specification

July 15, 2026
Author(s)
Peter Denno
This report describes a data mapping language, RADmapper, designed to provide an interoperable exchange form for expressing the intent of typical mapping and data restructuring needs. The exchange form of RADmapper code is intended to be translateable (by

Genome-wide detection of DNA double-strand breaks

July 8, 2026
Author(s)
Sierra Miller, Samantha Maragh
DNA double-strand breaks (DSBs) pose a major threat to genome stability, if not promptly and properly repaired. Understanding where, along the genome, DSBs arise and how they are repaired in genomic context is therefore essential to understand the biology

Communications Technology Laboratory's 6G Communications Roadmap

June 30, 2026
Author(s)
Richard Rouil, Nada Golmie, Miller Higgins, Ashlee Walker
The National Institute of Standards and Technology (NIST) Communications Technology Laboratory (CTL) developed the 6G Communications Roadmap (the roadmap) to prioritize future NIST investments in 6G Communications research that aligns with high-priority

Developing Security, Privacy, and Cybersecurity Supply Chain Risk Management Plans for Systems

June 30, 2026
Author(s)
Jeremy Licata, Rebecca McWhite, Laura Calloway, Meghan Anderson, Julie Snyder, Dylan Gilbert, Jeremy Miller
The system security plan, system privacy plan, and cybersecurity supply chain risk management plan are collectively referred to as system plans. They describe the purpose of the system, the operational status of the controls selected and allocated for

Innovations in advanced processes and systems for semiconductor manufacturing

June 30, 2026
Author(s)
Albert Shih, Wei Gao, Gregory Vogl, Dragan Djurdjanovic, Takafumi Fukushima, Ajay Malshe
The manufacturing of integrated circuits (ICs) is an enabler of technological innovation and is critical to the resilience of industry and national security. Four levels of excellence are necessary as the foundation for semiconductor manufacturing

Reference Correlation of the Thermal Conductivity of Neon

June 30, 2026
Author(s)
Marc Assael, Sofia Sotiriadou, Monika Thol, Marcia Huber
A new wide-ranging correlation for the thermal conductivity of neon, based on the most recent ab-initio dilute gas theoretical calculations, a simplified crossover critical enhancement contribution, and critically evaluated experimental data, is presented
Displaying 1 - 25 of 74400
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