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Displaying 1 - 25 of 74527

Supply Chain Traceability Principles: A Manufacturing Meta-Framework

September 9, 2026
Author(s)
Michael Pease, Evan Wallace, Harvey Reed, Robert Martin, Vivian L Martin, Steve Granata
Manufacturing supply chains are vital to national security and economic resilience. As these networks become increasingly complex, tracing products back to their origins becomes more difficult and exposes acquirers to greater risks from logistical

Manufacturing in a Circular Economy: Research Needs in Design, Systems Modeling, and Digital Thread

September 8, 2026
Author(s)
Noah Last, Kelsea Schumacher, Nehika Mathur, Vincenzo Ferrero, Matthew Triebe, Buddhika Hapuwatte, Naser Alqseer, Maya Reslan, Katherine Morris
Momentum is building to transition from a linear (take-make-use-discard) economy into a more circular one in which materials are kept in the economy through value-retention and -recovery processes. This momentum is taking the form of shifts in consumer

X-ray Absorption and Resonant X-ray Emission at the Carbon Edge of Li$_2$CO$_3$

September 8, 2026
Author(s)
John Vinson, Terrence Jach, Rainer Unterumsberger, Michael Woodcox, Burkhard Beckhoff
While highly successful, density functional theory is known to have limitations owing to its neglect of many-body electron-electron interactions. This neglect leads to errors in the single-particle energies, leading to underestimated band gaps and band

Supporting Reviewing of Thermophysical and Thermochemical Research Publications (IUPAC Technical Report)

September 7, 2026
Author(s)
Vladimir Diky, Ala Bazyleva, Debra Audus, Peter Dvorak, Ursula Kattner, Demian Riccardi, Jens Abildskov, Andrzej Anderko, Marc Assael, Olivier Baudouin, Jean-Charles de Hemptinne, Ralf Dohrn, J.Richard Elliott, Johan Jacquemin, Jean-Noel JAUBERT, Kevin Joback, Mohammad Khoshkbarchi, Georgios Kontogeorgis, Herbert Loria, Paul Mathias, Darrell Nordstrom, John O'Connell, Charles Oakes, Livio RUFFINE, Bastian Schmid, Cara Schwarz, Jeff Smith, Ana Soto, Vojtech Stejfa, Martin Trusler, Vaclav Vins, Boris Wilthan, Dzmitry Zaitsau
In order to support scientific reviewing in the area of material property research and make reviewing process easier and more efficient, checklists covering typical problems, lists of available resources, and computer-based tools helping to compose

An Instrumented Drop Tower for Impact and Stab Testing

September 4, 2026
Author(s)
Alexander Landauer, Ran Tao, Amanda Forster, Aaron Forster, Michael Riley
This report describes a 4 m instrumented drop tower (IDT) system in use at the National Institute Of Standards and Technology (NIST). Drop tower systems are a relatively common means of testing various impact-like scenarios, often for armor or padding

Redefining Reference Materials for the Evolving Metabolomics Landscape

September 2, 2026
Author(s)
Tracey Johnston, Fabio Casu, Ashley Russell, Hariharan Iyer, Kristine Gierz, William Davis, Amanda Bayless
The evolution of metabolomics, a field aimed at comprehensively measuring the chemical composition of a biological matrix, fundamentally reshaped the landscape of analytical measurement reliability. The 2011 release of Standard Reference Material (SRM)

Optical Measurement of Radiometric Aperture Areas

September 1, 2026
Author(s)
Ulf Griesmann
The National Institute of Standards and Technology (NIST) calibrates the areas of radiometric and photometric apertures using an optical coordinate measuring machine, which provides direct traceabililty of aperture areas to the length unit meter of the

Phish Out of Water: A Large-Scale Study of Phishing Email Cues

September 1, 2026
Author(s)
Jody Jacobs, Shanee Dawkins, Julia Sharp, Katherine Garcia, Brandon Pearson, Warda Usman, Alycia Carey, Joshua Reynolds, Chris Fennell
This poster presents the results of a study on people's perceptions of phishing email cues. The study, conducted in collaboration with Walmart's information security research team, examined whether the presence of certain cues impacts human phishing email

Workshop on Rolling Next-Generation Secure Hardware Into Standards

September 1, 2026
Author(s)
Sanjay Rekhi, Nedim Goren, Yang Guo
The Sustainable Hardware Security (SUSHI@NIST) Workshop on January 26, 2026, convened stakeholders from industry, academia, and government to identify priorities and develop actionable recommendations for advancing hardware security across the

A Reference Low-Pressure CO2 Adsorption Isotherm for Zeolite 13X: Results of an Interlaboratory Study

August 28, 2026
Author(s)
Huong Giang Nguyen, David Newton, Riaz Ahmad, Carsten Prinz, Mario Zorrilla-Valtierra, Krista Walton, Killian Gmyrek, Ronny Pini, Camille Petit, Marcus Lange, Jens Mollmer, Evelyn Fuhrmann, Katharina Volz, Garrett Taggart, Andreas Schreiber, Yuko Konishi, Kazuyuki Nakai, Christos Tampaxis, Theodore Steriotis, Hai Wang, Charles David Brewster, Mi Tian, Rajan Jagpal, Siyi Liu, George Neville, Sunanda Sain, Timothy Mays, Riccardo Rea, Enzo Mangano, Stefano Brandani, Maxwell Tsipoaka, Fateme Rezaei, Adrien Houze, Nicolas Heymans, Guy De Weireld, Charles Holland, Armin D. Ebner, James Ritter
This paper reports the results of an international interlaboratory study sponsored by the Versailles Project on Advanced Materials and Standards (VAMAS) and led by the National Institute of Standards and Technology (NIST) on the measurement of low-pressure

STANDARDS-BASED DIGITAL TWIN COMPOSITION: ROBOT ARM AND GRIPPER

August 26, 2026
Author(s)
Yehoshua Halle, Guodong Shao
Digital twins are used to monitor, diagnose, predict, and optimize systems' performance, often for the purpose of informing human decision-makers or automatically controlling systems. However, it is impractical to create a large-scale, monolithic digital

NIST Cybersecurity Framework 2.0 Informative References Quick-Start Guide

August 25, 2026
Author(s)
Stephen Quinn, Daniel Eliot, Greg Witte, Brad Hoehn
This publication explains what informative references are and how they support achieving the outcomes of the CSF 2.0. The guide introduces readers to NIST tools available for accessing, viewing, and using informative references for cybersecurity risk

Implications and Impacts of Mitigation Strategies for Wildland-Urban Interface Fire Smoke Exposure in Residential Environments

August 19, 2026
Author(s)
Nathan Lima, Aika Davis, Michael Link, Thomas Cleary, Ryan Falkenstein-Smith, Rileigh Robertson, Steven Emmerich, Benjamin Werden, Peter DeCarlo, Dustin Poppendieck
This study examines the effectiveness of various indoor air quality pollutant mitigation strategies during Wildland-Urban Interface (WUI) fire smoke events. We simulated WUI fire smoke conditions in the field by burning mixed-fuel cribs designed as

Tunable inter-bilayer magnetic correlations and candidate multipolar physics in the van der Waals oxyhalides DyOCl, DyOBr, and DyOI

August 19, 2026
Author(s)
F. Brooks, X. Bai, J. Bacsa, M. B. Stone, S. Calder, Nicholas Butch, V. Garlea, M. Mourigal
Rare-earth van der Waals magnets provide a route to combining strong spin-orbit coupling, large magnetic moments, and reduced dimensionality in bulk crystals. We report a comparative study of the dysprosium oxy halides DyOX (X = Cl, Br, I), which realize

Forward-Looking Codes and Standards

August 17, 2026
Author(s)
Jayantha Obeysekera, Jennifer Goupil, Meg Ackerson, Joe Ackroyd, Kevin Borth, Michel Ghosn, Matt Gilbertson, Elisabeth Gilmore, Jack Hogan, Sihan Li, Mari Tye, Therese McAllister
Forward Looking Codes and Standards: Final Report includes a summary and synthesis from the four workshop reports: Future Hazards, Future Load Effects, Design Guidelines and Criteria, and Adaptation and Resilience. The final report includes a summary state

Forward-Looking Codes and Standards: Adaptation and Resilience

August 17, 2026
Author(s)
Jayantha Obeysekera, Jennifer Goupil, Meg Ackerson, Joe Ackroyd, JOSEPH BARSUGLI, Kevin Borth, Michel Ghosn, Matt Gilbertson, Elisabeth Gilmore, Jack Hogan, Sihan Li, Mari Tye, Therese McAllister
Forward Looking Codes and Standards: Adaptation and Resilience workshop report includes recommended research needs on the following themes: adaptive design for buildings and infrastructure systems, considering future hazards, material durability, and

Forward-Looking Codes and Standards: Engineering Design Guidelines and Criteria

August 17, 2026
Author(s)
Jayantha Obeysekera, Jennifer Goupil, Meg Ackerson, Joe Ackroyd, JOSEPH BARSUGLI, Kevin Borth, Michel Ghosn, Matt Gilbertson, Elisabeth Gilmore, Jack Hogan, Sihan Li, Mari Tye
Forward Looking Codes and Standards: Engineering Design Guidelines and Criteria workshop report includes recommended research needs on the following themes: nonstationary reliability, service life, design loads, resistance, and structural capacity

Forward-Looking Codes and Standards: Future Hazards

August 17, 2026
Author(s)
Jayantha Obeysekera, Jennifer Goupil, Meg Ackerson, Joe Ackroyd, JOSEPH BARSUGLI, Kevin Borth, Michel Ghosn, Matthew Gilbertson, Elisabeth Gilmore, Jack Hogan, Sihan Li, Mari Tye
Forward Looking Codes and Standards: Future Hazards workshop report includes recommended research needs on the following themes: confidence and uncertainty in hazard projections, local downscaling of global models, and conversion of hazard projections to

Forward-Looking Codes and Standards: Future Load Effects

August 17, 2026
Author(s)
Jayantha Obeysekera, Jennifer Goupil, Meg Ackerson, Joe Ackroyd, JOSEPH BARSUGLI, Kevin Borth, Michel Ghosn, Matt Gilbertson, Elisabeth Gilmore, Jack Hogan, Sihan Li, Mari Tye
Forward Looking Codes and Standards: Future Load Effects workshop report includes recommended research needs on the following themes: changes in hazard demand relative to historical basis, changes in structural capacity due to changes in material

Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging

August 16, 2026
Author(s)
Ran Tao, Ryan Giang, Elena Moukhina, Amanda Forster, Tae Joon Cho, Polette Centellas, Stian Romberg, Zois Tsinas, Christopher Soles
Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect architectures
Displaying 1 - 25 of 74527
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