Leedy, K.
(1973),
Scanning electron microscope examination of wire bonds from high-reliability devices:, , National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NBS.TN.785
(Accessed May 22, 2025)
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Scanning electron microscope examination of wire bonds from high-reliability devices:
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- NBS TN 785
Report Number
NBS TN 785
Pub Type
NIST Pubs
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Created January 1, 1973, Updated May 19, 2023