Round Robin for Standardization of MEMS Length and Strain Measurements
Janet M. Cassard, Erik M. Secula, J Huang
A microelectromechanical systems (MEMS) Length and Strain Round Robin is underway to compare results of in-plane length measurements, residual strain measurements, and strain gradient measurements at a number of laboratories. The goal of this round robin is to demonstrate the reproducibility of measurements performed using the same test method at independent laboratories as well as the repeatability of measurements when performed using the same test method, in the same laboratory, by the same operator with the same equipment, in the shortest practicable period of time. Both of these measurements were done on essentially random test units made of the same homogeneous material. Any systematic difference in the results between the mean of a large number of test results and an accepted reference value will be reported as a bias. There were no surprising precision or bias results in this experiment. The final results from this length and strain round robin will be recorded in the three related American Society for Testing and Materials (ASTM) standard test methods for MEMS. This paper describes this MEMS Length and Strain Round Robin and presents a snapshot of the results as of the time of the writing of this paper.
SEMI Technology Symposium: Innovations in Semiconductor Manufacturing
, Secula, E.
and Huang, J.
Round Robin for Standardization of MEMS Length and Strain Measurements, SEMI Technology Symposium: Innovations in Semiconductor Manufacturing, San Francisco, CA, USA
(Accessed December 4, 2023)