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Round Robin for Standardization of MEMS Length and Strain Measurements

Published

Author(s)

Janet M. Cassard, Erik M. Secula, J Huang

Abstract

A microelectromechanical systems (MEMS) Length and Strain Round Robin is underway to compare results of in-plane length measurements, residual strain measurements, and strain gradient measurements at a number of laboratories. The goal of this round robin is to demonstrate the reproducibility of measurements performed using the same test method at independent laboratories as well as the repeatability of measurements when performed using the same test method, in the same laboratory, by the same operator with the same equipment, in the shortest practicable period of time. Both of these measurements were done on essentially random test units made of the same homogeneous material. Any systematic difference in the results between the mean of a large number of test results and an accepted reference value will be reported as a bias. There were no surprising precision or bias results in this experiment. The final results from this length and strain round robin will be recorded in the three related American Society for Testing and Materials (ASTM) standard test methods for MEMS. This paper describes this MEMS Length and Strain Round Robin and presents a snapshot of the results as of the time of the writing of this paper.
Proceedings Title
SEMI Technology Symposium: Innovations in Semiconductor Manufacturing
Conference Dates
July 12-14, 2004
Conference Location
San Francisco, CA, USA

Keywords

ASTM, cantilevers, fixed-fixed beams, interferometry, length measurements, MEMS, residual strain, round robin, strain gradient, test structures

Citation

Cassard, J. , Secula, E. and Huang, J. (2004), Round Robin for Standardization of MEMS Length and Strain Measurements, SEMI Technology Symposium: Innovations in Semiconductor Manufacturing, San Francisco, CA, USA (Accessed June 19, 2024)

Issues

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Created July 11, 2004, Updated October 12, 2021