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Roles of Adhesive and Interfacial Properties on Humidity-induced Failure

Published

Author(s)

Kar T. Tan, Christopher C. White, Donald L. Hunston, Kristen L. Steffens, Hatlee Timothy, Kristen Hamilton, Vogt D. Bryan

Abstract

Adhesion loss due to moisture is a fundamental problem in a large diversity of industries ranging from microelectronics and automotive to aerospace. This study investigates the durability of model adhesive joints consisting of a homologous series of poly(n-alkyl methacrylate)s (PAMA) supported on SiOx substrates. This polymer series enables the exploration of subtle chemistry effects on moisture-induced adhesion loss. A fracture mechanics approach based on a shaft-loaded blister test was adapted to measure adhesive fracture energy of the joints exposed to extremes of humidity. Contact angle measurement, and infrared and X-ray photoelectron spectroscopic techniques were used to elucidate mechanisms of adhesion loss.
Proceedings Title
Proceedings of the 33th Annual Meeting of the Adhesion Society, Inc.
Conference Dates
February 21-24, 2010
Conference Location
Daytona Beach, FL

Keywords

Adhesion loss, moisture effect, interface, water attack.

Citation

Tan, K. , White, C. , Hunston, D. , , K. , Timothy, H. , Hamilton, K. and Bryan, V. (2010), Roles of Adhesive and Interfacial Properties on Humidity-induced Failure, Proceedings of the 33th Annual Meeting of the Adhesion Society, Inc., Daytona Beach, FL (Accessed June 13, 2024)

Issues

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Created February 21, 2010, Updated February 19, 2017