Roles of Adhesive and Interfacial Properties on Humidity-induced Failure
Kar T. Tan, Christopher C. White, Donald L. Hunston, Kristen L. Steffens, Hatlee Timothy, Kristen Hamilton, Vogt D. Bryan
Adhesion loss due to moisture is a fundamental problem in a large diversity of industries ranging from microelectronics and automotive to aerospace. This study investigates the durability of model adhesive joints consisting of a homologous series of poly(n-alkyl methacrylate)s (PAMA) supported on SiOx substrates. This polymer series enables the exploration of subtle chemistry effects on moisture-induced adhesion loss. A fracture mechanics approach based on a shaft-loaded blister test was adapted to measure adhesive fracture energy of the joints exposed to extremes of humidity. Contact angle measurement, and infrared and X-ray photoelectron spectroscopic techniques were used to elucidate mechanisms of adhesion loss.
Proceedings of the 33th Annual Meeting of the Adhesion Society, Inc.
February 21-24, 2010
Daytona Beach, FL
Adhesion loss, moisture effect, interface, water attack.
, White, C.
, Hunston, D.
, , K.
, Timothy, H.
, Hamilton, K.
and Bryan, V.
Roles of Adhesive and Interfacial Properties on Humidity-induced Failure, Proceedings of the 33th Annual Meeting of the Adhesion Society, Inc., Daytona Beach, FL
(Accessed December 4, 2023)