Stori, J.
, Brady, K.
and Thurman, T.
(2009),
Representation of a thermal resistor network model of a packaged component in STEP AP210 edition 2:, , National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NIST.IR.7648
(Accessed March 13, 2025)
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Representation of a thermal resistor network model of a packaged component in STEP AP210 edition 2:
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- NIST IR 7648
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NIST IR 7648
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NIST Pubs
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Created January 1, 2009, Updated May 20, 2023