Probing the Interfacial Adhesion Strength in Compositional Libraries of Epoxy Films

Published

May 1, 2006

Author(s)

Christopher Stafford, J Y. Kim, D Kawaguchi, Gareth Royston, Martin Chiang

Abstract

We are developing a measurement platform, based on the edge lift-off test geometry, geared towards combinatorial and high-throughput (C&HT) assessment of interfacial reliability in thermally cured epoxy materials. A critical parameter space to be explored is composition of the epoxy formulation. We have constructed an automated mixing and deposition system for the creation of discrete and continuous gradients in composition of a thermally cured epoxy system. By dicing the combinatorial library into a contiguous discrete sample array, the interfacial adhesion strength can be deduced from the critical stress required to debond each film cell from the substrate. These results can be used to predict the adhesion reliability of epoxy formulations as a function of composition and applied stress.

Proceedings Title

Materials Research Society Fall Meeting | | | Materials Research Society

Volume

39

Conference Dates

November 27-December 1, 2005

Conference Location

Undefined

Conference Title

MRS Proceedings

Pub Type

Conferences

Download Paper

Local Download

Keywords

adhesion, combinatorial, composition, copper, edge delamination, epoxy, gradient, interface, metrology

Citation

Stafford, C. , Kim, J. , Kawaguchi, D. , Royston, G. and Chiang, M. (2006), Probing the Interfacial Adhesion Strength in Compositional Libraries of Epoxy Films, Materials Research Society Fall Meeting | | | Materials Research Society, Undefined, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852601 (Accessed October 24, 2025)