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Probing the Interfacial Adhesion Strength in Compositional Libraries of Epoxy Films
Published
Author(s)
Christopher Stafford, J Y. Kim, D Kawaguchi, Gareth Royston, Martin Chiang
Abstract
We are developing a measurement platform, based on the edge lift-off test geometry, geared towards combinatorial and high-throughput (C&HT) assessment of interfacial reliability in thermally cured epoxy materials. A critical parameter space to be explored is composition of the epoxy formulation. We have constructed an automated mixing and deposition system for the creation of discrete and continuous gradients in composition of a thermally cured epoxy system. By dicing the combinatorial library into a contiguous discrete sample array, the interfacial adhesion strength can be deduced from the critical stress required to debond each film cell from the substrate. These results can be used to predict the adhesion reliability of epoxy formulations as a function of composition and applied stress.
Proceedings Title
Materials Research Society Fall Meeting | | | Materials Research Society
Stafford, C.
, Kim, J.
, Kawaguchi, D.
, Royston, G.
and Chiang, M.
(2006),
Probing the Interfacial Adhesion Strength in Compositional Libraries of Epoxy Films, Materials Research Society Fall Meeting | | | Materials Research Society, Undefined, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852601
(Accessed October 2, 2025)