Attota, R.
, Kang, H.
and Bunday, B.
(2019),
Nondestructive and Economical Dimensional Metrology of Deep Structures, Frontiers of Characterization and Metrology for Nanoelectronics (FCMN), Monterey, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=927455
(Accessed March 13, 2025)
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Nondestructive and Economical Dimensional Metrology of Deep Structures
Published
Author(s)
, Hyeonggon Kang, Benjamin Bunday
Conference Dates
April 2-4, 2019
Conference Location
Monterey, CA
Conference Title
Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)
Pub Type
Conferences
Download Paper
Keywords
TSOM, nondestructive process control, three-dimensional metrology, through-focus scanning optical microscopy, nanometrology, packaging metrology, high-throughput semiconductor metrology
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created April 1, 2019, Updated January 27, 2020