Nondestructive and Economical Dimensional Metrology of Deep Structures

Published: April 01, 2019

Author(s)

Ravikiran Attota, Hyeonggon Kang, Benjamin Bunday
Conference Dates: April 2-4, 2019
Conference Location: Monterey, CA
Conference Title: Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)
Pub Type: Conferences

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Keywords

TSOM, nondestructive process control, three-dimensional metrology, through-focus scanning optical microscopy, nanometrology, packaging metrology, high-throughput semiconductor metrology
Created April 01, 2019, Updated June 27, 2019