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A New Technique for Determining Long-Term TDDB Acceleration Parameters of Thin Gate Oxides
Published
Author(s)
Y Chen, John S. Suehle, Chien-Chung Shen, J B. Bernstein, C. Messick, P Chaparala
Abstract
A new technique, the dual voltage versus time curve (V-t) integration technique, is presented as a much faster method to obtain time-dependent dielectric breakdown (TDDB) acceleration parameters ([alpha] and [tau]) of ultra-thin gate oxides compared to conventional long-term constant voltage stress tests. The technique uses V-t curves measured during highly accelerated constant or ramped current injection breakdown tests. It is demonstrated that the technique yields acceleration parameters that are statistically identical to values obtained from long-term constant voltage TDDB tests. In contrast to traditional TDDB tests, the proposed technique requires over an order of magnitude less testing time, a smaller sample size, and can be used during production monitoring.
Chen, Y.
, Suehle, J.
, Shen, C.
, Bernstein, J.
, Messick, C.
and Chaparala, P.
(1998),
A New Technique for Determining Long-Term TDDB Acceleration Parameters of Thin Gate Oxides, IEEE Electron Device Letters
(Accessed October 15, 2025)