Rae, A.
and Handwerker, C.
(2021),
NEMI's Characterization of Lead-Free Alloy Applicable to Today's Commercially Available Alloys, Circuit Assembly
(Accessed December 6, 2023)
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NEMI's Characterization of Lead-Free Alloy Applicable to Today's Commercially Available Alloys
Published
Author(s)
A -. Rae,
Abstract
Invited article in Circuits Assembly magazine that discusses how the NEMI Project's extensive characterization of the NEMI Sn-Ag-Cu alloy applies to other commercial Sn-Ag-Cu alloys being used in other parts of the world.Citation
Circuit Assembly
Pub Type
Journals
Keywords
lead-free, NEMI
Citation
Created October 12, 2021