Rae, A.
and Handwerker, C.
(2021),
NEMI's Characterization of Lead-Free Alloy Applicable to Today's Commercially Available Alloys, Circuit Assembly
(Accessed June 16, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
NEMI's Characterization of Lead-Free Alloy Applicable to Today's Commercially Available Alloys
Published
Author(s)
A -. Rae,
Abstract
Invited article in Circuits Assembly magazine that discusses how the NEMI Project's extensive characterization of the NEMI Sn-Ag-Cu alloy applies to other commercial Sn-Ag-Cu alloys being used in other parts of the world.Citation
Circuit Assembly
Pub Type
Journals
Keywords
lead-free, NEMI
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created October 12, 2021