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NEMI's Characterization of Lead-Free Alloy Applicable to Today's Commercially Available Alloys

Published

Author(s)

A -. Rae, C A. Handwerker

Abstract

Invited article in Circuits Assembly magazine that discusses how the NEMI Project's extensive characterization of the NEMI Sn-Ag-Cu alloy applies to other commercial Sn-Ag-Cu alloys being used in other parts of the world.
Citation
Circuit Assembly

Keywords

lead-free, NEMI

Citation

Rae, A. and Handwerker, C. (2021), NEMI's Characterization of Lead-Free Alloy Applicable to Today's Commercially Available Alloys, Circuit Assembly (Accessed June 17, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created October 12, 2021