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On the Nature of Machining Cracks in Ground Ceramics: Part II, Comparison to Other Silicon Nitrides and Damage Maps

Published

Author(s)

George D. Quinn, L K. Ives, S Jahanmir

Abstract

The size and severity of grinding machining cracks in a sintered reaction bonded silicon nitride from part I are compared to data for other silicon nitrides. Crack sizes follow a similar trend with grinding wheel grit size despite differences in microstructures, strengths, and fracture toughnesses. Silicon nitrides with enhanced fracture toughness actually develop deeper machining cracks than cracks in less tough silicon nitrides. Machining damage maps for silicon nitride are devised.
Citation
Machining Science and Technology
Volume
9

Keywords

fractography, fracture toughness, grinding wheel, machining cracks, silicon nitride

Citation

Quinn, G. , Ives, L. and Jahanmir, S. (2003), On the Nature of Machining Cracks in Ground Ceramics: Part II, Comparison to Other Silicon Nitrides and Damage Maps, Machining Science and Technology (Accessed May 23, 2024)

Issues

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Created May 19, 2003, Updated February 19, 2017