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A Model of Chemical Mechanical Polishing

Published

Author(s)

E W. Paul

Abstract

A model of chemical mechanical modeling (CMP) is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing rate is followed by an asymtotic approach to a maximum rate. The causes and implications of this behavior are discussed.
Citation
Journal of Electrochemical Society
Volume
148
Issue
6

Keywords

CMP

Citation

Paul, E. (2001), A Model of Chemical Mechanical Polishing, Journal of Electrochemical Society (Accessed February 25, 2024)
Created June 1, 2001, Updated February 19, 2017