Paul, E.
(2001),
A Model of Chemical Mechanical Polishing, Journal of Electrochemical Society (Accessed July 30, 2026)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
A Model of Chemical Mechanical Polishing
Published
Author(s)
Abstract
A model of chemical mechanical modeling (CMP) is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing rate is followed by an asymtotic approach to a maximum rate. The causes and implications of this behavior are discussed.Citation
Journal of Electrochemical Society
Volume
148
Issue
6
Pub Type
Journals
Keywords
CMP
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created June 1, 2001, Updated February 19, 2017