Josell, D.
, Wallace, W.
, Warren, J.
, Powell, A.
and Wheeler, D.
(2002),
Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Lateral of Force-Displacement Curves, Journal of Electronic Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853016
(Accessed October 8, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Lateral of Force-Displacement Curves
Published
Author(s)
, , , Aadam C. Powell,
Abstract
This paper presents the results of wetting experiments between copper pads on silicon substrates in geometries relevant to flip-chip applications. Measurements of solder joint dimensions, specifically stand-off height and lateral offset (i.e., misalignment), as functions of the applied force (normal and shear), solder volume and pad diameter are presented. The experimentally measured force-displacement relationships are compared with predictions obtained from the minimum energy model of the Surface Evolver. For the case of the axisymmetric joint (zero shear) an exact solution to the capillary equations is also used.Citation
Journal of Electronic Packaging
Volume
124
Issue
No. 3
Pub Type
Journals
Download Paper
Keywords
alignment, flip-chip, solder, solderjoint, Surface-Evolver, wetting
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created August 31, 2002, Updated October 12, 2021