Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Lateral of Force-Displacement Curves
Daniel Josell, William E. Wallace, James A. Warren, Aadam C. Powell, Daniel Wheeler
This paper presents the results of wetting experiments between copper pads on silicon substrates in geometries relevant to flip-chip applications. Measurements of solder joint dimensions, specifically stand-off height and lateral offset (i.e., misalignment), as functions of the applied force (normal and shear), solder volume and pad diameter are presented. The experimentally measured force-displacement relationships are compared with predictions obtained from the minimum energy model of the Surface Evolver. For the case of the axisymmetric joint (zero shear) an exact solution to the capillary equations is also used.
, Wallace, W.
, Warren, J.
, Powell, A.
and Wheeler, D.
Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Lateral of Force-Displacement Curves, Journal of Electronic Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853016
(Accessed December 10, 2023)