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Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Lateral of Force-Displacement Curves

Published

Author(s)

Daniel Josell, William E. Wallace, James A. Warren, Aadam C. Powell, Daniel Wheeler

Abstract

This paper presents the results of wetting experiments between copper pads on silicon substrates in geometries relevant to flip-chip applications. Measurements of solder joint dimensions, specifically stand-off height and lateral offset (i.e., misalignment), as functions of the applied force (normal and shear), solder volume and pad diameter are presented. The experimentally measured force-displacement relationships are compared with predictions obtained from the minimum energy model of the Surface Evolver. For the case of the axisymmetric joint (zero shear) an exact solution to the capillary equations is also used.
Citation
Journal of Electronic Packaging
Volume
124
Issue
No. 3

Keywords

alignment, flip-chip, solder, solderjoint, Surface-Evolver, wetting

Citation

Josell, D. , Wallace, W. , Warren, J. , Powell, A. and Wheeler, D. (2002), Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Lateral of Force-Displacement Curves, Journal of Electronic Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853016 (Accessed June 19, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created August 31, 2002, Updated October 12, 2021