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Microfabricated Atomic Frequency References

Published

Author(s)

Svenja A. Knappe, P Schwindt, V Shah, Leo W. Hollberg, John Kitching, Li-Anne Liew, John Moreland

Abstract

We report on the fabrication of a physics package for a chip-scale atomic clock with a volume of 9.5 mm^3, consuming 75 m W of power. The design is described in detail and is strongly motivated by the goal of wafer-level fabrication and assembly. A fractional frequency instability of 2.4 x 10-10 at one second of integration is demonstrated; the long- term drift is -2 X 10-8/day. We discuss the performance of the clock at short and long integration times as well as its power consumption, and suggest possible improvements.
Proceedings Title
Proc. IEEE Intl. Ultrasonics, Ferroelectrics, and Frequency Control Anniversary Joint Conf.
Conference Dates
August 24-27, 2004
Conference Location
Montreal, 1, CA
Conference Title
IEEE Intl. Ultrasonics, Ferroelectrics, and Frequency Control Conf.

Keywords

atomic frequency reference, chip-scale atomic clock, frequency instability, vapor cell, wafer-level integration

Citation

Knappe, S. , Schwindt, P. , Shah, V. , Hollberg, L. , Kitching, J. , Liew, L. and Moreland, J. (2004), Microfabricated Atomic Frequency References, Proc. IEEE Intl. Ultrasonics, Ferroelectrics, and Frequency Control Anniversary Joint Conf., Montreal, 1, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50086 (Accessed April 18, 2024)
Created August 22, 2004, Updated October 12, 2021