Koseski, R.
, Osborn, W.
, Stranick, S.
, DelRio, F.
, Vaudin, M.
, Dao, T.
, Adams, V.
and Cook, R.
(2011),
Micro-scale measurement and modeling of stress in silicon surrounding a tungsten-filled through-silicon via, Journal of Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=908908
(Accessed December 14, 2024)