Measurement of Thermal Properties of Gypsum Board at Elevated Temperatures

Published

May 30, 2005

Author(s)

Samuel L. Manzello, Seul-Hyun Park, Dale P. Bentz, Tensei Mizukami

Abstract

The thermal conductivity, specific heat, mass loss, and linear contraction for gypsum board types widely used in the USA and Japan were measured both at room temperature and elevated temperatures. The gypsum board types tested include Type X and Type C from the USA and Type R and Type F from Japan. Results indicate that the difference in thermal properties of all gypsum board samples tested in the present study is not significant, particularly at elevated temperatures. A large difference in linear contraction among gypsum board samples was observed at elevated temperatures, implying a significant difference in mechanical behavior at fire temperatures. The experimental data set provides valuable information that can be used to model the behavior of gypsum board at elevated temperatures.

Citation

Fire Technology

Pub Type

Journals

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Keywords

Gypsum Board, Thermal Properties

Citation

Manzello, S. , Park, S. , Bentz, D. and Mizukami, T. (2005), Measurement of Thermal Properties of Gypsum Board at Elevated Temperatures, Fire Technology, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=900117 (Accessed October 16, 2025)