Harman, G.
and Wilson, C.
(1989),
Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices, Proc. MRS Symposium on Electronics Packaging, San Diego, CA, USA
(Accessed July 26, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices
Published
Author(s)
,
Proceedings Title
Proc. MRS Symposium on Electronics Packaging
Volume
154
Conference Dates
April 24-29, 1989
Conference Location
San Diego, CA, USA
Pub Type
Conferences
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created December 30, 1989, Updated October 12, 2021