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Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices

Published

Author(s)

George G. Harman, Charles L. Wilson
Proceedings Title
Proc. MRS Symposium on Electronics Packaging
Volume
154
Conference Dates
April 24-29, 1989
Conference Location
San Diego, CA, USA

Citation

Harman, G. and Wilson, C. (1989), Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices, Proc. MRS Symposium on Electronics Packaging, San Diego, CA, USA (Accessed April 20, 2024)
Created December 30, 1989, Updated October 12, 2021