Harman, G.
and Wilson, C.
(1989),
Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices, Proc. MRS Symposium on Electronics Packaging, San Diego, CA, USA
(Accessed March 23, 2025)
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Materials Problems Affecting Reliability and Yield of Wire Bonding in VLSI Devices
Published
Author(s)
,
Proceedings Title
Proc. MRS Symposium on Electronics Packaging
Volume
154
Conference Dates
April 24-29, 1989
Conference Location
San Diego, CA, USA
Pub Type
Conferences
Citation
Issues
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Created December 30, 1989, Updated October 12, 2021