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Manufacture of Extremely Flat 300 mm Silicon Wafers



Marc Tricard, Paul Dumas, Christopher Hall, Ulf Griesmann, Quandou (. Wang


The flatness requirement for silicon wafers at the exposure site will be lower than 50 nm by 2010 and may be as low as 25nm by 2015 (TRS 2005).  This creates new challenges for both wafer polishing and metrology tools capable of meeting the specifications with sufficient accuracy and spatial resolution.  Results of fabricating extremely flat 300mm silicon wafers using Magnetorheological Finishing (MRF) will be reported.  Flatness metrology was provided by the improved infrared interferometer (IR3) at NIST, which is capable of measuring the Total Thickness Variation of a 300mm wafer with a reproducibility of 3nm.
Cirp Annals-Manufacturing Technology


finishing, interferometry, wafer


Tricard, M. , Dumas, P. , Hall, C. , Griesmann, U. and Wang, Q. (2021), Manufacture of Extremely Flat 300 mm Silicon Wafers, Cirp Annals-Manufacturing Technology (Accessed June 25, 2024)


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Created October 12, 2021