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Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems

Published

Author(s)

V. H. Adams, David L. Blackburn, Yogendra K. Joshi, David W. Berning
Citation
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume
420-431
Issue
4

Citation

Adams, V. , Blackburn, D. , Joshi, Y. and Berning, D. (1997), Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems, IEEE Transactions on Components Packaging and Manufacturing Technology Part A (Accessed May 19, 2024)

Issues

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Created November 30, 1997, Updated October 12, 2021