Adams, V.
, Blackburn, D.
, Joshi, Y.
and Berning, D.
(1997),
Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems, IEEE Transactions on Components Packaging and Manufacturing Technology Part A
(Accessed October 14, 2024)
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Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems
Published
Author(s)
V. H. Adams, , ,
Citation
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume
420-431
Issue
4
Pub Type
Journals
Citation
Issues
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Created November 30, 1997, Updated October 12, 2021