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Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems

Published

Author(s)

V. H. Adams, David L. Blackburn, Yogendra K. Joshi, David W. Berning
Proceedings Title
Proc., Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII
Issue
158
Conference Dates
January 28-30, 1997
Conference Location
Austin, TX, USA

Citation

Adams, V. , Blackburn, D. , Joshi, Y. and Berning, D. (1997), Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems, Proc., Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII, Austin, TX, USA (Accessed December 9, 2024)

Issues

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Created December 30, 1997, Updated October 12, 2021