Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems

Published

Author(s)

V. H. Adams, David L. Blackburn, Yogendra K. Joshi, David W. Berning
Proceedings Title
Proc., Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII
Issue
158
Conference Dates
January 28-30, 1997
Conference Location
Austin, TX, USA

Citation

Adams, V. , Blackburn, D. , Joshi, Y. and Berning, D. (1997), Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems, Proc., Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII, Austin, TX, USA (Accessed March 5, 2024)
Created December 30, 1997, Updated October 12, 2021