Adams, V.
, Blackburn, D.
, Joshi, Y.
and Berning, D.
(1997),
Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems, Proc., Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII, Austin, TX, USA
(Accessed May 10, 2024)
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Issues in Validating Package Thermal Models for Natural Convection Cooled Electronic Systems
Published
Author(s)
V. H. Adams, , ,
Proceedings Title
Proc., Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII
Issue
158
Conference Dates
January 28-30, 1997
Conference Location
Austin, TX, USA
Pub Type
Conferences
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created December 30, 1997, Updated October 12, 2021