Allen, R.
(2010),
Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
(Accessed January 23, 2025)
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Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
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Author(s)
Abstract
The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due to the numerous process steps that the wafers have undergone and the presence of Through-Silicon Vias (TSVs), bonded wafers containing 3D ICs are expected to suffer a higher rate of post-bonding voids than other bonding applications. In addition, 3D ICs will likely be more sensitive to small voids than other bond applications. In this round robin experiment eight approaches to void metrology are being compared by 13 participating laboratories to highlight the relative abilities of each of these metrologies to identify potentially killer defects.Pub Type
Talks
Keywords
microelectromechanical systems (MEMS), three-dimensional integrated circuit (3D IC), wafer bonding, bond void metrology
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Created October 14, 2010, Updated February 19, 2017