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Instrumented Indentation and Ultrasonic Velocity Techniques for the Evaluation of Creep Cavitation in Silicon Nitride
Published
Author(s)
F Lofaj, Douglas T. Smith, Gerald V. Blessing, William E. Luecke, Sheldon M. Wiederhorn
Abstract
Instrumented indentation and ultrasonic wave velocity techniques combined with precise density change measurements and transmission electron microscopy (TEM) were used to investigate the changes of elastic moduli in silicon nitride after tensile deformation up to 3 %.
Lofaj, F.
, Smith, D.
, Blessing, G.
, Luecke, W.
and Wiederhorn, S.
(2003),
Instrumented Indentation and Ultrasonic Velocity Techniques for the Evaluation of Creep Cavitation in Silicon Nitride, Journal of Materials Science
(Accessed October 18, 2025)