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Instrumented Indentation and Ultrasonic Velocity Techniques for the Evaluation of Creep Cavitation in Silicon Nitride

Published

Author(s)

F Lofaj, Douglas T. Smith, Gerald V. Blessing, William E. Luecke, Sheldon M. Wiederhorn

Abstract

Instrumented indentation and ultrasonic wave velocity techniques combined with precise density change measurements and transmission electron microscopy (TEM) were used to investigate the changes of elastic moduli in silicon nitride after tensile deformation up to 3 %.
Citation
Journal of Materials Science
Volume
38
Issue
No. 7

Keywords

creep cavitation, silicon nitride, ultrasonic velocity techniques

Citation

Lofaj, F. , Smith, D. , Blessing, G. , Luecke, W. and Wiederhorn, S. (2003), Instrumented Indentation and Ultrasonic Velocity Techniques for the Evaluation of Creep Cavitation in Silicon Nitride, Journal of Materials Science (Accessed March 29, 2024)
Created December 31, 2002, Updated October 12, 2021