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An Improved Multi-layer Fabrication Process for YBa2Cu3O7-x-based Circuits

Published

Author(s)

H. Q. Li, Ronald H. Ono, Leila R. Vale, David A. Rudman, Sy-Hwang Liou, W. H. Mallison
Citation
IEEE Transactions on Applied Superconductivity
Volume
7
Issue
2

Citation

Li, H. , Ono, R. , Vale, L. , Rudman, D. , Liou, S. and Mallison, W. (1997), An Improved Multi-layer Fabrication Process for YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-x</sub>-based Circuits, IEEE Transactions on Applied Superconductivity (Accessed April 20, 2024)
Created May 31, 1997, Updated October 12, 2021