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Global Convergence on a Single Lead-Free Solder Alloy: Transitioning to Pb-Free Assemblies

Published

Author(s)

C A. Handwerker

Abstract

This article discusses the dominant Pb-free alloy system used worldwide and its assembly behavior when Pb-free and Sn-Pb alloys and processes are mixed and the effects on the structure and properties of the as-solidified solder joints. The conditions under which Sn-Pb pastes, solder baths, and processes form reliable joints with Sn-Ag-Cu surface finishes on components and boards is referred to as backward compatibility. Likewise, during the transition to completely Pb-free assemblies, the conditions for forward compatibility are found when Sn-Ag-Cu pastes, solder baths and processes form reliable joints when used with Sn-Pb surface finishes on components
Citation
Circuits Assembly

Keywords

circuit boards assembly, electronic packaging, lead-free solder, Pb-free, RoHS, WEEE

Citation

Handwerker, C. (2008), Global Convergence on a Single Lead-Free Solder Alloy: Transitioning to Pb-Free Assemblies, Circuits Assembly (Accessed April 12, 2024)
Created October 16, 2008