Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte

Published

June 6, 2013

Author(s)

Daniel Josell, Thomas P. Moffat

Abstract

Superconformal Au deposition is demonstrated in a Na_{3}Au(SO_{3})_{2} based electrolyte that exhibits critical behavior with addition of the deposition-rate suppressing additive polyethyleneimine (PEI). The critical behavior is revealed as hysterestic cyclic-voltammetry manifesting the existence of a potential range over which two states can exist: one in which adsorbed PEI suppresses gold deposition and the other in which ongoing gold deposition continues to disrupt and bury arriving suppressor, the specimen history determining the state observed. Superconformal extreme bottom-up filling of Through Silicon Vias (TSVs) and superconformal filling of Damascene trenches are demonstrated and explained in this context.

Citation

Journal of the Electrochemical Society

Pub Type

Journals

Citation

Josell, D. and Moffat, T. (2013), Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte, Journal of the Electrochemical Society (Accessed June 9, 2023)