Sorenson, E.
, Bradley, P.
, Lauria, D.
, Takaki, B.
, Thompson, M.
, Liu, H.
and Liew, L.
(2026),
Evaluating MEMS switch lifetime at cryogenic temperatures, Journal of Microelectronics and Electronic Packaging, [online], https://doi.org/10.4071/001c.163972, https://nps-ext.nist.gov/nps/nps_public_api/api/Publication/file/961491 (Accessed November 12, 2026)
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Evaluating MEMS switch lifetime at cryogenic temperatures
Published
Author(s)
, , , Brandon Takaki, Matt Thompson, Harry Liu,
Abstract
This paper describes methods to test hermetically packaged MEMS switches, at cryogenic temperatures, for shifts in mechanical and DC characteristics over lifetime. The test methods were performed on two sets of commercially available radio frequency Microelectromechanical Systems (RF MEMS) switches. One set of MEMS switches was cooled to 17 K while the other set was simultaneously cooled to 60 K. The switches were then cycled on and off to failure, and their DC characteristics periodically remeasured. In this set of tests, two MEMS switches failed after 50 million to 150 million switching cycles at 17 K but regained functionality after they were turned off for several hours or after the temperature was temporarily increased to > 41 K and re-cooled to 17K. No failure was observed in an identical MEMS switch after 3.1 billion switching cycles at 60 K. The hysteresis characteristics of all switches were found to depend on both temperature and the cumulative number of cycles at fixed temperature. The switching time was found to be independent of both temperature and number of cycles. These test methods may provide useful information for MEMS switch manufacturers and users to develop cryogenic-specific applications and manufacturing processes.Citation
Journal of Microelectronics and Electronic Packaging
Volume
23
Issue
3
Pub Type
Journals
Download Paper
Keywords
Cryogenic, MEMS switch, reliability, RF MEMS
Citation
Issues
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Created September 15, 2026, Updated October 30, 2026