NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Evaluating CT for Metrology: The Influence of Material Thickness on Measurements
Published
Author(s)
Joseph Schlecht, Eric Ferley, Shaun COUGHLIN , Steven D. Phillips, Vincent Lee, Craig M. Shakarji
Abstract
X-ray imaging provides a non-destructive means to measure internal features of a workpiece, and CT offers unique capabilities for internal measurements in 3-D. However, due to the computational nature of CT and its indirect measurement process, assessing its efficacy for dimensional metrology is essential. CT reconstruction artefacts are of primary concern as they may influence measurements. In this paper we investigate the effect of varying material thickness on CT reconstructions for metrology. We show that applying several thicknesses of material does not present significant issues for CT-based metrology. The results advocate further exploration of CT as a means for internal workpiece measurement and metrology.
Conference Dates
October 6-10, 2014
Conference Location
Prague, AL, CZ
Conference Title
11th European Conference on Non-Destructive Testing
Schlecht, J.
, Ferley, E.
, COUGHLIN, S.
, Phillips, S.
, Lee, V.
and Shakarji, C.
(2014),
Evaluating CT for Metrology: The Influence of Material Thickness on Measurements, 11th European Conference on Non-Destructive Testing, Prague, AL, CZ, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=916961
(Accessed October 22, 2025)