Bertocci, U.
(2004),
An EQMB Examination of Cu Surface Oxides in Borate Buffer, Electrochimica Acta
(Accessed May 17, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
An EQMB Examination of Cu Surface Oxides in Borate Buffer
Published
Author(s)
Abstract
The oxidation and reduction of copper, either electrodeposited or vapor-deposited onto quartz crystal resonators, was examined in borate/boric acid mixtures at different pH's, comparing electrochemical measurements with mass changes. The results showed that at pH = 8.8, Cu dissolution significantly influences the microbalance readings. It was found that, when surface oxidation during potentiodynamic scans is limited in the anodic direction, the first reduction peak is caused by Cu redeposition and not be oxide reduction. At pH = 10.0, Cu dissolution is minimal, and the microbalance signal is given by surface oxidation or reduction. Comparing charge and mass data, it was found that the reaction Cu+ Cu is the formation or reduction of Cu2O while the reaction Cu++ Cu+ most likely involves some hydroxide.Citation
Electrochimica Acta
Volume
49
Issue
No. 11
Pub Type
Journals
Keywords
copper, dissolution, electrodeposited, oxidation
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created April 1, 2004, Updated February 17, 2017