Landauer, A.
(2026),
A digital image correlation-based research platform for cure shrinkage and thermal expansion measurements on epoxy test materials, 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), [online], https://doi.org/10.1109/ECTC51846.2026.00309, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961654 (Accessed July 10, 2026)
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A digital image correlation-based research platform for cure shrinkage and thermal expansion measurements on epoxy test materials
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Abstract
NIST is developing a suite of material metrology tools to understand and characterize the development of residual stresses during epoxy curing. In this work, the application of digital image correlation (DIC)-based metrology for coefficient of thermal expansion (CTE) and (effective) cure shrinkage (E)CS is described. The DIC setup and experimental considerations are explained in detail. An example analysis of CTE for a prototype test material, also under development at NIST, is discussed with the example CTE data shown.Citation
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
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Journals
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Keywords
Epoxy packaging, digital image correlation, cure shrinkage, coefficient of thermal expansion
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Created June 17, 2026, Updated July 9, 2026