A software-controlled thermal cycling test system developed for SiC module package characterization is presented. Its interface permits the flexible definition of testing parameters like variable data acquisition rates and customizable cycle transitions duration, where dwell times and the heating and cooling slope rates of the test can be independently controlled. The cycle heating is provided by a controlled power supply, while two independent mass flow controllers provide the cycle cooling control, which can be a combination of air and water flows depending on the test conditions. The interface provides visual feedback by showing constantly the heatplate temperature and thermal cycling measurements in situ. A package reliability study is currently underway to demonstrate system functionality and flexibility. Temperature-sensitive parameter (TSP) measurements are used to monitor package degradation based on electrical performance changes as the thermal cycling progresses.
Proceedings Title: Proceedings of the IEEE COMPEL Workshop 2010
Conference Dates: June 28-30, 2010
Conference Location: Boulder, CO
Conference Title: IEEE COMPEL 2010
Pub Type: Conferences
thermal cycling, software tool, SiC module packages, reliability study