Vartuli, C.
, Stevie, F.
, Wollman, D.
, Antonell, M.
, Irwin, R.
, McKinley, J.
, Shofner, T.
, Purcell, B.
, Anderson, S.
and To, B.
(2000),
Comparison of Elemental Detection Using Microcalorimetry, SIMS, AES and EDS (SEM, STEM, and TEM), Microscopy and Microanalysis
(Accessed October 14, 2025)
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Comparison of Elemental Detection Using Microcalorimetry, SIMS, AES and EDS (SEM, STEM, and TEM)
Published
Author(s)
C. B. Vartuli, F. A. Stevie, , M. Antonell, R. B. Irwin, J. M. McKinley, T L. Shofner, B. M. Purcell, S. A. Anderson, Bobby To
Abstract
Cu contamination has become a larger concern as more semiconductor fabrication facilities switch from aluminum to Cu interconnects. The resolution limits of several analytical tools are compared to determine the optimum analysis methods for detecting Cu contamination in semiconductor materials. The elemental detection limits of Secondary Ion Mass Spectrometry (SIMS), Auger Electron Spectrometry (AES), Microcalorimetry and Energy Dispersive Spectrometry (EDS) systems on Scanning Electron Microscopy (TEM) instruments are evaluated for Cu in Wsix.Citation
Microscopy and Microanalysis
Volume
8/13-8/17/00
Pub Type
Journals
Keywords
Auger electron spectrometry, energy dispersive spectrometry, microcalorimetry, microcalorimeter
Citation
Issues
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Created July 31, 2000, Updated October 12, 2021