Combinatorial Techniques to Measure Curing of Epoxy Films

Published

February 1, 2004

Author(s)

Aaron M. Forster, D Ragahavan, Naomi Eidelman, Alamgir Karim

Abstract

Combinatorial methods were implemented in the investigation of time and temperature effects on epoxy curing by using three complementary techniques: axisymmetric adhesion testing, FT-IR reflectance mapping, and confocal fluorescence mapping to characterize the interfacial, chemical, and physical changes in the polymer with increased cure. Diglycidyl ether bisphenol A epoxy resin was mixed with fluorescent dye (4 dimethylamino-4 -nitrostilbene) and a curing agent (2,4,6-tri(dimethyl amino methyl) phenol) and flow coated on a glass substrate. The sample was placed on a temperature gradient stage (50 to 100)oC for 15, 30, 45, 60, and 180 min intervals to create a curing gradient in the film. After each curing cycle, the sample was characterized along the curing gradient using the three techniques described above.

Proceedings Title

Adhesion Society, Annual Meeting|27th|From Moldcules and Mechanics to Optimization and Design of Adhesive Joints|Adhesion Society

Volume

27

Conference Dates

February 1, 2004

Conference Location

Undefined

Conference Title

Proceedings of the Annual Meeting - Adhesion Society

Pub Type

Conferences

Keywords

adhesion, epoxy curing, JKR, work of debonding

Citation

Forster, A. , Ragahavan, D. , Eidelman, N. and Karim, A. (2004), Combinatorial Techniques to Measure Curing of Epoxy Films, Adhesion Society, Annual Meeting|27th|From Moldcules and Mechanics to Optimization and Design of Adhesive Joints|Adhesion Society, Undefined (Accessed October 21, 2025)