Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Combinatorial Edge Delamination Test for Thin Film Adhesion Concept, Procedure, Results

Published

Author(s)

Martin Y. Chiang, J He, R Song, Alamgir Karim, Wen-Li Wu, Eric J. Amis

Abstract

A high-throughput combinatorial approach to edge delamination test is proposed to map the failure of adhesion as a function of both temperature and film thickness in a single step. In this approach, a single specimen of a thin film bonded to a substrate with orthogonal thickness and temperature gradients is subdivided into separate samples. This approach can be adopted to measure the adhesion for films with thickness in the sub-micron range by the addition of an overlayer. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. An initial test result is presented to demonstrate the feasibility of the approach.
Proceedings Title
Fracture of Polymers, Composites and Adhesives, Conference | | | Elsevier
Volume
32
Conference Dates
September 1, 2002
Conference Location
Diablerets, SZ
Conference Title
ESIS Publication

Keywords

adhesion, combinatorial approach, edge delumination, finite element, fracture mechanics, interfacial debounding, thin film

Citation

Chiang, M. , He, J. , Song, R. , Karim, A. , Wu, W. and Amis, E. (2003), Combinatorial Edge Delamination Test for Thin Film Adhesion Concept, Procedure, Results, Fracture of Polymers, Composites and Adhesives, Conference | | | Elsevier, Diablerets, SZ, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852169 (Accessed April 24, 2024)
Created July 1, 2003, Updated February 19, 2017