Combinatorial Edge Delamination Test for Thin Film Adhesion Concept, Procedure, Results

Published

July 1, 2003

Author(s)

Martin Y. Chiang, J He, R Song, Alamgir Karim, Wen-Li Wu, Eric J. Amis

Abstract

A high-throughput combinatorial approach to edge delamination test is proposed to map the failure of adhesion as a function of both temperature and film thickness in a single step. In this approach, a single specimen of a thin film bonded to a substrate with orthogonal thickness and temperature gradients is subdivided into separate samples. This approach can be adopted to measure the adhesion for films with thickness in the sub-micron range by the addition of an overlayer. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. An initial test result is presented to demonstrate the feasibility of the approach.

Proceedings Title

Fracture of Polymers, Composites and Adhesives, Conference | | | Elsevier

Volume

32

Conference Dates

September 1, 2002

Conference Location

Diablerets, SZ

Conference Title

ESIS Publication

Pub Type

Conferences

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Keywords

adhesion, combinatorial approach, edge delumination, finite element, fracture mechanics, interfacial debounding, thin film

Citation

Chiang, M. , He, J. , Song, R. , Karim, A. , Wu, W. and Amis, E. (2003), Combinatorial Edge Delamination Test for Thin Film Adhesion Concept, Procedure, Results, Fracture of Polymers, Composites and Adhesives, Conference | | | Elsevier, Diablerets, SZ, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852169 (Accessed December 7, 2024)