NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation

Published

Author(s)

Martin Chiang, Wen-Li Wu, J He, Eric J. Amis

Abstract

A high-throughput combinatorial approach to the edge delamination test is proposed. This approach can construct the failure map as a function of temperature and film thickness in one-step for a thin film bonded to a substrate. A modified combinatorial approach is also proposed for the measurement of the adhesion reliability for films with thickness in the sub-micron range. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. A simulation is used to prove the feasibility of the combinatorial approach and to design the experimental protocol.
Citation
Thin Solid Films
Volume
437
Issue
No. 1-2
Pub Type
Journals

Download Paper

Local Download

Keywords

adhesion reliability, combinatorial approach, edge delimination, finite element, fracture mechanics, thin film
Polymers, Materials characterization, Composition and structure and Biomaterials

Citation

Chiang, M. , Wu, W. , He, J. and Amis, E. (2003), Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852056 (Accessed October 1, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created July 31, 2003, Updated October 12, 2021
Was this page helpful?