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Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation

Published

Author(s)

Martin Chiang, Wen-Li Wu, J He, Eric J. Amis

Abstract

A high-throughput combinatorial approach to the edge delamination test is proposed. This approach can construct the failure map as a function of temperature and film thickness in one-step for a thin film bonded to a substrate. A modified combinatorial approach is also proposed for the measurement of the adhesion reliability for films with thickness in the sub-micron range. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. A simulation is used to prove the feasibility of the combinatorial approach and to design the experimental protocol.
Citation
Thin Solid Films
Volume
437
Issue
No. 1-2

Keywords

adhesion reliability, combinatorial approach, edge delimination, finite element, fracture mechanics, thin film

Citation

Chiang, M. , Wu, W. , He, J. and Amis, E. (2003), Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852056 (Accessed May 28, 2024)

Issues

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Created July 31, 2003, Updated October 12, 2021