Chiang, M.
, Wu, W.
, He, J.
and Amis, E.
(2003),
Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852056
(Accessed May 1, 2024)
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Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation
Published
Author(s)
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Abstract
A high-throughput combinatorial approach to the edge delamination test is proposed. This approach can construct the failure map as a function of temperature and film thickness in one-step for a thin film bonded to a substrate. A modified combinatorial approach is also proposed for the measurement of the adhesion reliability for films with thickness in the sub-micron range. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. A simulation is used to prove the feasibility of the combinatorial approach and to design the experimental protocol.Citation
Thin Solid Films
Volume
437
Issue
No. 1-2
Pub Type
Journals
Download Paper
Keywords
adhesion reliability, combinatorial approach, edge delimination, finite element, fracture mechanics, thin film
Citation
Created July 31, 2003, Updated October 12, 2021