Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation
Martin Chiang, Wen-Li Wu, J He, Eric J. Amis
A high-throughput combinatorial approach to the edge delamination test is proposed. This approach can construct the failure map as a function of temperature and film thickness in one-step for a thin film bonded to a substrate. A modified combinatorial approach is also proposed for the measurement of the adhesion reliability for films with thickness in the sub-micron range. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. A simulation is used to prove the feasibility of the combinatorial approach and to design the experimental protocol.
, Wu, W.
, He, J.
and Amis, E.
Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Concept and Simulation, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852056
(Accessed December 6, 2023)