Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Adaptibility and Variability

Published

April 1, 2005

Author(s)

Martin Y. Chiang, R Song, A J. Crosby, Alamgir Karim, C. K. Chiang, Eric J. Amis

Abstract

In this study, a high-throughput combinatorial approach to edge delamination test is proposed to map the failure of adhesion as a function of both temperature and film thickness in a single step. In this approach, a single specimen of a thin film bonded to a substrate with or-thogonal thickness and temperature gradients is subdivided into separate samples. This approach can be adopted to measure the adhesion reliability for films with thickness in the sub-micron range by the addition of an overlayer. Also, through the study of the surface energy effect on the adhe-sion of a film/substrate system, the variability of the ap-proach for constructing the reliability distribution of the adhesion (as a function of other material parameters) has been demonstrated.

Citation

Thin Solid Films

Volume

476

Issue

No. 2

Pub Type

Journals

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Keywords

adhesion reliability, combinatorial method, edge delamination, thin film

Citation

Chiang, M. , Song, R. , Crosby, A. , Karim, A. , Chiang, C. and Amis, E. (2005), Combinatorial Approach to the Edge Delamination Test for Thin Film Reliability - Adaptibility and Variability, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852362 (Accessed October 10, 2025)