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PUBLICATIONS

CHIP SCALE FORCE ELASTIC PROVING DEVICE FOR INSTRUMENTED INDENTER FORCE CALIBRATION

Published

Author(s)

Gordon A. Shaw

Abstract

A chip-scale elastic fused silica parallelogram flexure device has been fabricated for use as a reference spring for force calibration in instrumented indentation devices. The device includes an integrated optical fiber laser interferometer to measure displacement in response to applied gravitational forces from test masses. The linear spring constant of the devices is measured with approximately 1 % relative combined standard uncertainty and was verified by measurement in a calibrated instrumented indentation machine. The device can be useful for field or high-temperature applications.
Proceedings Title
Proceedings of the XXIV IMEKO World Congress
Conference Dates
August 26-29, 2024
Conference Location
Hamburg, DE
Conference Title
XXIV IMEKO World Congress
Pub Type
Conferences

Keywords

mass, force, indentation, nanotechnology
Mechanical properties

Citation

Shaw, G. (2024), CHIP SCALE FORCE ELASTIC PROVING DEVICE FOR INSTRUMENTED INDENTER FORCE CALIBRATION, Proceedings of the XXIV IMEKO World Congress, Hamburg, DE (Accessed October 27, 2025)

Issues

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Created April 22, 2024, Updated July 1, 2024
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